•High thermal conductivity
•High dielectric constant
•High dissipation factor
•Use with heat sinks or metal chassis
•Will not dry or harden
•Contains zincs oxides and polydimenthyl siloxane
•Non-silicone version available
Designed for use in transferring heat away from electrical and electronic devices such as; transistors, power diodes, semi-conductors, ballast's and thermocouple wells. High thermal conductivity, high dielectric constant, high dissipation factor, use with heat sinks or metal chassis, will not dry or harden. Contains zinc oxide and polydimethyl siloxane.
